Invention Publication
- Patent Title: MEMORY DEVICE AND REPAIR METHOD OF THE MEMORY DEVICE
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Application No.: US18425747Application Date: 2024-01-29
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Publication No.: US20240257898A1Publication Date: 2024-08-01
- Inventor: Taehong KWON , Daeseok Byeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230011948 2023.01.30
- Main IPC: G11C29/00
- IPC: G11C29/00

Abstract:
A memory device is provided. The memory device includes: a first cell region provided in a first layer and including a first bit line and a first redundant bit line; a second cell region provided in a second layer and including a second bit line and a second redundant bit line; a peripheral region provided in a third layer and including first page buffers configured to be respectively connected to the first bit line and the second bit line, and a second page buffer configured to be commonly connected to the first redundant bit line and the second redundant bit line; and a control circuit configured to: based on the first bit line being defective, replace the first bit line with the first redundant bit line; and based on the second bit line being defective, replace the second bit line with the second redundant bit line.
Information query