- 专利标题: DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION
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申请号: US18622472申请日: 2024-03-29
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公开(公告)号: US20240240316A1公开(公告)日: 2024-07-18
- 发明人: Purushottam Kumar , Adrien LaVoie , Jun Qian , Hu Kang , Ishtak Karim , Fung Suong Ou
- 申请人: Lam Research Corporation
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 分案原申请号: US16137329 2018.09.20
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; C23C16/52 ; H01L21/02 ; H01L21/285
摘要:
Methods and apparatuses for controlling precursor flow in a semiconductor processing tool are disclosed. A method may include flowing gas through a gas line, opening an ampoule valve(s), before a dose step, to start a flow of precursor from the ampoule to a process chamber through the gas line, closing the ampoule valve(s) to stop the precursor from flowing out of the ampoule, opening a process chamber valve, at the beginning of the dose step, to allow the flow of precursor to enter the process chamber, and closing the process chamber valve, at the end of the dose step, to stop the flow of precursor from entering the process chamber. A controller may include at least one memory and at least one processor and the at least one memory may store instructions for controlling the at least one processor to control precursor flow in a semiconductor processing tool.
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