A semiconductor package includes a base structure and a plurality of semiconductor chips disposed on the base structure. Each of the plurality of semiconductor chips has a chip region. The plurality of semiconductor chips are stacked in a vertical direction such that chip regions at least partially overlap each other. In the stack of the plurality of semiconductor chips, each of the plurality of semiconductor chips has a first width in a first direction and a second width in a second direction. The plurality of semiconductor chips include a first semiconductor chip and a second semiconductor chip, having scribe regions on opposite sides of each of the chip regions. A first width of the first semiconductor chip is greater than a first width of the second semiconductor chip.