Invention Publication
- Patent Title: INTEGRATED CIRCUIT DEVICE
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Application No.: US18366922Application Date: 2023-08-08
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Publication No.: US20240178274A1Publication Date: 2024-05-30
- Inventor: Gunho Jo , Heesub Kim , Seung Hyun Lim , Bomi Kim , Eunho Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR 20220165108 2022.11.30
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/092 ; H01L29/423 ; H01L29/66 ; H01L29/775

Abstract:
An integrated circuit device includes a first fin-type active region and a second fin-type active region, a device isolation film adjacent to each of the first and second fin-type active regions, a first gate line on the first fin-type active region, a second gate line on the second fin-type active region, and a gate cut insulating pattern separating the first and second gate lines, wherein the device isolation film includes a first local isolation portion and a second local isolation portion, which are separating the first fin-type active region from the second fin-type active region to be apart from each other with the gate cut insulating pattern therebetween.
Information query
IPC分类: