Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING STACKS ASIDE STACKED GATE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Application No.: US18429264Application Date: 2024-01-31
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Publication No.: US20240172434A1Publication Date: 2024-05-23
- Inventor: Chien-Hsuan Liu , Chiang-Ming Chuang , Chih-Ming Lee , Kun-Tsang Chuang , Hung-Che Liao , Chia-Ming Pan , Hsin-Chi Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H10B41/30
- IPC: H10B41/30 ; H01L21/28 ; H01L21/3213 ; H01L29/423 ; H01L29/66 ; H01L29/788 ; H10B41/10 ; H10B41/42 ; H10B41/47

Abstract:
A semiconductor device includes a stacked gate structure, a plurality of stacks and a first conductive layer. The stacks are disposed aside the stacked gate structure and arranged along both a first direction and a second direction perpendicular to the first direction, wherein the stacks are extended continuously along the first direction and segmented in the second direction. The first conductive layer is disposed between segmented portions of the stacks along the second direction, wherein top surfaces of the segmented portions of the stacks are higher than a top surface of the first conductive layer.
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