A curable resin composition for use in a sealing material for film liquid crystal panel, the composition containing: (A) a polyfunctional thiol compound; (B) a polyfunctional (meth)acrylic compound which has 3-6 (meth)acrylic groups and has a (meth)acrylic equivalent of 100-250; (C) a polyfunctional acrylic compound which has 2-4 (meth)acrylic groups; and (D) a photopolymerization initiator. The blending mass ratio of (B)/(C) is 0.1-1.0, and the ratio between thiol groups of(A) and polymerizable unsaturated bonds of (B) and (C) (thiol groups/polymerizable unsaturated bonds) is 0.5-3.0.