- 专利标题： PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
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申请号： US18415801申请日： 2024-01-18
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公开(公告)号： US20240153840A1公开(公告)日： 2024-05-09
- 发明人: Shin-Puu JENG , Po-Yao LIN , Feng-Cheng HSU , Shuo-Mao CHEN , Chin-Hua WANG
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 分案原申请号： US16182750 2018.11.07
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L21/48 ; H01L21/56 ; H01L25/00 ; H01L25/18
摘要：
A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.
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