Invention Publication
- Patent Title: PICK-UP STRUCTURE OF MEMORY DEVICE AND METHOD FOR MANUFACTURING MEMORY DEVICE
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Application No.: US18491226Application Date: 2023-10-20
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Publication No.: US20240147717A1Publication Date: 2024-05-02
- Inventor: Hsin-Hung CHOU , Cheng-Shuai LI , Kao-Tsair TSAI
- Applicant: WINBOND ELECTRONICS CORP.
- Applicant Address: TW Taichung City
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung City
- Priority: TW 1140650 2022.10.26
- Main IPC: H10B41/42
- IPC: H10B41/42 ; H10B43/40

Abstract:
A pick-up structure of a memory device and a method of manufacturing the memory device are provided. The pick-up structure includes pick-up electrode stripes. Each pickup electrode stripe includes a main body portion in the peripheral pick-up region and an extending portion extending from the main body portion to the memory cell region. The extending portion is narrower than the main body portion. The sidewall surface of the extending portion is aligned with the sidewall surface of the main body portion.
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