Semiconductor packages and methods for forming semiconductor packages are disclosed. An example semiconductor package includes a substrate and a core. An insulator material is present over the core, and along a direction perpendicular to a first surface of the core, a portion of the insulator material is between the core and a first surface of the substrate. A via extends between the first surface of the core and a second surface of the core in the direction perpendicular to the first surface of the core. A bridge die is in a recess in the substrate. The bridge die is coupled with the via. An electronic component is coupled to an end of the via at a second surface of the substrate.