Invention Publication
- Patent Title: Test Architecture for High Throughput Testing of Pixel Driver Chips for Display Application
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Application No.: US18358559Application Date: 2023-07-25
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Publication No.: US20240105525A1Publication Date: 2024-03-28
- Inventor: Imran Hashim , Xiang Lu , Stanley B. Wang , Xuchun Liu , Mahdi Farrokh Baroughi , Yongjie Jiang , Hopil Bae , Hasan Akyol , Baris Posat , John T. Wetherell , Lei Wu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: G09G3/32
- IPC: G09G3/32 ; H01L25/075 ; H01L33/62
Abstract:
Test structures and methods of testing pixel driver chip donor wafers are described. In an embodiment, a redistribution layer is formed over a pixel driver chip donor wafer and probed to determine known good dies, followed by removal of the RDL. In other embodiments, test routing is formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.
Information query
IPC分类:
