发明公开
- 专利标题： DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE MOUNT DEVICES
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申请号： US17951523申请日： 2022-09-23
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公开(公告)号： US20240105390A1公开(公告)日： 2024-03-28
- 发明人: Kok Meng KAM , Eng Wah WOO , Samantha CHEANG , Marvin MARBELL , Haedong JANG , Jeremy FISHER , Basim NOORI
- 申请人： WOLFSPEED, INC.
- 申请人地址： US NC Durham
- 专利权人： WOLFSPEED, INC.
- 当前专利权人： WOLFSPEED, INC.
- 当前专利权人地址： US NC Durham
- 主分类号： H01G4/228
- IPC分类号： H01G4/228 ; H01L23/00 ; H01L23/48 ; H01L25/04 ; H01L49/02
摘要：
In some aspects, a device includes a substrate. A first metallization arranged on the substrate. A second metallization arranged on the substrate. A circuit arranged on the substrate and electrically connected to the first metallization and the second metallization. The first metallization and the second metallization being configured, structured, and arranged to make a solder connection to a device, where the substrate may include silicon carbide (SiC).
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