Invention Publication
- Patent Title: METHODS FOR DEPOSITING MOLYBDENUM SULFIDE
-
Application No.: US18378425Application Date: 2023-10-10
-
Publication No.: US20240035152A1Publication Date: 2024-02-01
- Inventor: Keith T. Wong , Hyojin Kim
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US17028156 2020.09.22
- Main IPC: C23C16/30
- IPC: C23C16/30 ; C23C16/02 ; C23C16/455 ; C23C16/56 ; H10B12/00
Abstract:
Methods of depositing a molybdenum sulfide film with increased sulfur:molybdenum ratio are described. The methods include pre-cleaning a dielectric material with oxygen radicals prior to formation of a molybdenum sulfide film that has a lower oxygen content than would be formed without the pre-cleaning.
Information query
IPC分类:
