发明公开
- 专利标题: THERMAL MANAGEMENT DEVICE
-
申请号: US18214621申请日: 2023-06-27
-
公开(公告)号: US20240017584A1公开(公告)日: 2024-01-18
- 发明人: Yoshio HASEGAWA , Satoshi Furukawa , Mitsuyo Omura
- 申请人: TOYOTA JIDOSHA KABUSHIKI KAISHA , SUBARU CORPORATION
- 申请人地址: JP Toyota-shi
- 专利权人: TOYOTA JIDOSHA KABUSHIKI KAISHA,SUBARU CORPORATION
- 当前专利权人: TOYOTA JIDOSHA KABUSHIKI KAISHA,SUBARU CORPORATION
- 当前专利权人地址: JP Toyota-shi; JP Tokyo
- 优先权: JP 22113053 2022.07.14
- 主分类号: B60H1/00
- IPC分类号: B60H1/00 ; B60H1/22 ; H01M10/6551 ; H01M10/48 ; H01M10/63 ; H01M10/6569 ; H01M10/625
摘要:
A thermal management device includes a first thermal circuit, a second thermal circuit, and a control unit. The first thermal circuit includes a first radiator and a battery. The second thermal circuit includes a heater, a temperature sensor, a first path, a second radiator, a second path, a heating appliance, and a flow rate adjusting unit. When a battery heating request and an air heating request are made, the control unit heats a second thermal transfer medium, and divides the flow of the second thermal transfer medium to the first and second paths. When a deficiency value of measured temperature with respect to a target temperature of the second thermal transfer medium is greater than a first threshold value in flow dividing processing, a second flow dividing proportion of the second path is set to be greater than a first flow dividing proportion of the first path.
信息查询