Invention Application
- Patent Title: HIGH SPEED INTERFACE
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Application No.: US17453157Application Date: 2021-11-01
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Publication No.: US20230138758A1Publication Date: 2023-05-04
- Inventor: Deepali Anand SANE , Stephen Douglas HAWN , Charles Samuel SALDANA SCHULMAN
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Main IPC: H01R12/79
- IPC: H01R12/79 ; H01R12/59 ; H01R12/67

Abstract:
A flat flexible cable (FFC) is configured to facilitate high-speed communications, such as USB Superspeed 3.0 signals, between processors. The FFC includes at least two differential signal pairs arranged directly adjacent to one another on opposite sides of an isolation gap consisting of non-conductive material. The size of the isolation gap may be tailored in proportion to the frequency of signals supported by the FFC.
Public/Granted literature
- US12176642B2 High speed interface Public/Granted day:2024-12-24
Information query
IPC分类: