Invention Application
- Patent Title: BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED METHODS
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Application No.: US17972674Application Date: 2022-10-25
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Publication No.: US20230133526A1Publication Date: 2023-05-04
- Inventor: Thomas J. Colosimo, JR. , Matthew B. Wasserman , Adeel Bajwa
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bond head assembly for bonding a semiconductor element to a substrate at a bonding area of the bonding system; a reducing gas delivery system for providing a reducing gas to the bonding area during bonding of the semiconductor element to the substrate; and a gas composition analyzer configured for continuously monitoring a composition of the reducing gas during operation of the bonding system.
Information query
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