- 专利标题： ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF
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申请号： US18088009申请日： 2022-12-23
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公开(公告)号： US20230128594A1公开(公告)日： 2023-04-27
- 发明人: Min Sung CHOI
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2015-0015309 20150130
- 主分类号： H01F27/29
- IPC分类号： H01F27/29 ; H01F41/10 ; H01F17/04 ; H01F17/00 ; H01F41/04
摘要：
An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.
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