- 专利标题： ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL THICKNESS ON SAME BUILDUP LAYER
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申请号： US17482852申请日： 2021-09-23
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公开(公告)号： US20230087810A1公开(公告)日： 2023-03-23
- 发明人: Jeremy D. ECTON , Kristof DARMAWIKARTA , Suddhasattwa NAD , Oscar OJEDA , Bai NIE , Brandon C. MARIN , Gang DUAN , Jacob VEHONSKY , Onur OZKAN , Nicholas S. HAEHN
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/00
摘要：
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a plurality of stacked layers. In an embodiment, a first trace is on a first layer, wherein the first trace has a first thickness. In an embodiment, a second trace is on the first layer, wherein the second trace has a second thickness that is greater than the first thickness. In an embodiment, a second layer is over the first trace and the second trace.
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