Invention Application
- Patent Title: INSULATING DEVICE
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Application No.: US17814702Application Date: 2022-07-25
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Publication No.: US20230086597A1Publication Date: 2023-03-23
- Inventor: Satoshi AKUTSU , Kazuyuki ITO , Takuo KIKUCHI , Nobuaki MAKINO , Tatsuya OHGURO , Yoshihiko FUJI
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo; JP Tokyo
- Priority: JP2021-152281 20210917
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F38/14

Abstract:
An insulating device includes a first element, a second element, a first lead, a second lead, and a resin member. The second element is electrically connected to the first element. The first element is mounted on the first lead. The second lead includes a first surface and a second surface, the second surface being at a side opposite to the first surface. The second element is mounted to the first surface. the second lead is arranged to overlap the first element in a direction crossing the second surface of the second lead. The resin member seals the first element, the second element, the first lead, and the second lead.
Information query