• Patent Title: REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
  • Application No.: US17800154
    Application Date: 2021-02-17
  • Publication No.: US20230076438A1
    Publication Date: 2023-03-09
  • Inventor: Ikuya FUKASAWAYohei IKEBE
  • Applicant: HOYA CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: HOYA CORPORATION
  • Current Assignee: HOYA CORPORATION
  • Current Assignee Address: JP Tokyo
  • Priority: JP2020-040732 20200310
  • International Application: PCT/JP2021/005881 WO 20210217
  • Main IPC: G03F1/24
  • IPC: G03F1/24 G03F1/52
REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
Provided is a reflective mask blank.
The reflective mask blank has a multilayer reflective film and a thin film for pattern formation in this order on a main surface of a substrate; the thin film consists of a single layer structure consisting of a ruthenium-containing layer at least containing ruthenium, nitrogen, and oxygen or a multilayer structure including the ruthenium-containing layer; and when the ruthenium-containing layer is subjected to an analysis by an In-Plane measurement of an X-ray diffraction method to obtain an X-ray diffraction profile where, provided I_P1 is the maximum value of diffraction intensity within a diffraction angle 2θ ranging from 65 degrees to 75 degrees and I_avg is the average value of diffraction intensity within a diffraction angle 2θ ranging from 55 degrees to 65 degrees, I_P1/I_avg is greater than 1.0 and less than 3.0.
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