- 专利标题: Electronic Devices with Interconnected Ground Structures
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申请号: US17828859申请日: 2022-05-31
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公开(公告)号: US20230387584A1公开(公告)日: 2023-11-30
- 发明人: Siddharth Ravichandran , Puneeth Prahalad , Vijaykrishnan Ramakrishnan , Sathish Shanbhag Kota
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 主分类号: H01Q1/48
- IPC分类号: H01Q1/48 ; H01Q1/52 ; H01Q1/22
摘要:
An electronic device may include wireless circuitry having one or more antennas. An antenna ground for an antenna may be formed from two separate conductive ground structures coupled to each other via a conductive interconnect structure. A slot element may be formed in one of the conductive ground structures to reject signals at one or more victim frequencies resulting from spurious signals generated by a non-ohmic contact formed between the conductive interconnect structure and the one of the conductive ground structures. The conductive interconnect structure may overlap and excite the slot element, which serves as an ineffective radiator at the one or more victim frequencies.
公开/授权文献
- US12107328B2 Electronic devices with interconnected ground structures 公开/授权日:2024-10-01
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