- 专利标题: SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
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申请号: US18344571申请日: 2023-06-29
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公开(公告)号: US20230352485A1公开(公告)日: 2023-11-02
- 发明人: Shih-Yao Lin , Chih-Han Lin , Ming-Ching Chang , Shu-Yuan Ku , Tzu-Chung Wang
- 申请人: Taiwan Semiconductor Manufacturing Company Limited
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; H01L29/66 ; H01L21/8234 ; H01L29/06 ; H01L29/78
摘要:
A semiconductor device includes a substrate. The semiconductor device includes a dielectric fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate isolation structure vertically disposed above the dielectric fin. The semiconductor device includes a gate structure extending along a second direction perpendicular to the first direction. The gate structure includes a first portion and a second portion separated by the gate isolation structure and the dielectric fin. The first portion of the gate structure presents a first beak profile and the second portion of the gate structure presents a second beak profile. The first and second beak profiles point toward each other.
公开/授权文献
- US12021084B2 Semiconductor devices and methods of manufacturing thereof 公开/授权日:2024-06-25
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