Provided is a system for routing connections to a logic circuit, the system including a first wafer having a backside and a frontside opposite the backside, a power conductor at the backside of the first wafer, a core at the frontside of the first wafer, a power via electrically connected to the power conductor and to the core, a signal pad at the backside of the first wafer, a first frontside signal-routing metal at the frontside of the first wafer, and a signal via connected to the signal pad and the first frontside signal-routing metal.