发明公开
- 专利标题： SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF FORMING THE SAME
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申请号： US18325205申请日： 2023-05-30
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公开(公告)号： US20230299017A1公开(公告)日： 2023-09-21
- 发明人: Shu-Shen YEH , Che-Chia YANG , Chia-Kuei HSU , Ming-Chih YEW , Po-Yao LIN , Shin-Puu JENG
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/48 ; H01L23/053 ; H01L23/13
摘要：
A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, an electronic component, a ring structure, and an adhesive layer. The electronic component is located over a surface of the substrate. The ring structure is located over the surface of the substrate and surrounding the electronic component. The ring structure has a bottom surface facing the surface of the substrate and a top surface opposite the bottom surface. The ring structure includes recesses recessed from and located on the top surface, wherein the recesses are arranged corresponding to the corners of the substrate. The adhesive layer is interposed between the bottom surface of the ring structure and the surface of the substrate.
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