An open-loop electrical current transducer for surface mounting on an external circuit board, including an integrated circuit (IC) chip including a magnetic field sensing portion and connection terminals on a first active side of the IC chip, a lead frame arrangement including a primary conductor and a plurality of secondary conductors comprising IC connection portions, a plurality of bond wires interconnecting the IC connection portions to the connection terminals of the IC chip, and an insulating overmold housing overmolded over the IC chip, the bond wires, and a portion of the lead frame arrangement. The lead frame arrangement is formed from sheet metal having a base sheet of thickness B wherein at least portions of the lead frame arrangement include a thickness equal to the base sheet thickness B. The first active side of the IC chip faces the lead frame arrangement and at least a portion of the lead frame arrangement includes a thinned portion of thickness T between 20% and 80% of the base sheet thickness B, the thinned portion of thickness T including the IC connection portions of the secondary conductors.