Invention Publication
- Patent Title: COMPOUND STRUCTURE AND FORMING METHOD THEREOF
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Application No.: US18047970Application Date: 2022-10-19
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Publication No.: US20230175122A1Publication Date: 2023-06-08
- Inventor: Jungwon PARK , Jihoon KIM
- Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION , INSTITUTE FOR BASIC SCIENCE
- Applicant Address: KR Seoul
- Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION,INSTITUTE FOR BASIC SCIENCE
- Current Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION,INSTITUTE FOR BASIC SCIENCE
- Current Assignee Address: KR Seoul
- Priority: KR 20210143315 2021.10.26
- Main IPC: C23C16/30
- IPC: C23C16/30 ; C23C16/02 ; C23C16/458 ; C23C16/46
Abstract:
A compound structure and a forming method thereof are provided. The method of forming a compound structure according to embodiments of the present invention comprises loading a metal precursor on a substrate, providing a chalcogen precursor to the substrate, and reacting the chalcogen precursor with the metal precursor. The compound structure according to embodiments of the present invention is formed by the method and has a 2-dimensional structure.
Public/Granted literature
- US12188120B2 Method of forming compound structure with 2-dimensional structure Public/Granted day:2025-01-07
Information query
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