- 专利标题： SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
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申请号： US17717674申请日： 2022-04-11
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公开(公告)号： US20230154879A1公开(公告)日： 2023-05-18
- 发明人: Si Yun KIM , Kang Hun KIM , Jun Yong SONG
- 申请人： SK hynix Inc.
- 申请人地址： KR Icheon-si Gyeonggi-do
- 专利权人： SK hynix Inc.
- 当前专利权人： SK hynix Inc.
- 当前专利权人地址： KR Icheon-si Gyeonggi-do
- 优先权： KR 20210157869 2021.11.16
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A semiconductor device is provided. The semiconductor device includes a substrate, input and output (I/O) pads disposed at an upper portion of the semiconductor substrate, and first bump pillars disposed over the I/O pads. The first bump pillars are selectively arranged over some of the I/O pads in a first horizontal direction.
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