The semiconductor package, includes: a package substrate; a substrate adhesive member on the package substrate; a plurality of semiconductor chips stacked on the substrate adhesive member and including first and second semiconductor chips; and a conductive connection member connecting the package substrate and the semiconductor chips, each of the semiconductor chips including a semiconductor chip body, a chip pad, an upper oxide layer comprised of a first material and covering an upper surface of the semiconductor chip body and exposing a portion of an upper surface of the chip pad, and a lower oxide layer comprised of a second material and covering a lower surface of the semiconductor chip body, wherein the upper oxide layer of the first semiconductor chip has an oxide bonding region between the first material and the second material in a first region in contact with the lower oxide layer of the second semiconductor chip.