- 专利标题： DRIVING CHIP, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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申请号： US17886161申请日： 2022-08-11
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公开(公告)号： US20220384427A1公开(公告)日： 2022-12-01
- 发明人: Yicheng Du , Meng Wang , Hui Yu
- 申请人： Silergy Semiconductor Technology (Hangzhou) LTD
- 申请人地址： CN Hangzhou
- 专利权人： Silergy Semiconductor Technology (Hangzhou) LTD
- 当前专利权人： Silergy Semiconductor Technology (Hangzhou) LTD
- 当前专利权人地址： CN Hangzhou
- 优先权： CN201810943003.7 20180817
- 主分类号： H01L27/06
- IPC分类号： H01L27/06 ; H01L21/761 ; H01L49/02
摘要：
A semiconductor structure can include: a semiconductor substrate having a first region, a second region, and an isolation region disposed between the first region and the second region; an isolation component located in the isolation region; and where the isolation component is configured to recombine first carriers flowing from the first region toward the second region, and to extract second carriers flowing from the second region toward the first region.
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