Invention Application
- Patent Title: DISPLAY BACKPLANE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND FABRICATION METHOD THEREOF
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Application No.: US17417660Application Date: 2020-10-22
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Publication No.: US20220344557A1Publication Date: 2022-10-27
- Inventor: Haixu LI , Guangcai YUAN , Zhanfeng CAO , Ke WANG , Qi QI
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2020/122922 WO 20201022
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00

Abstract:
The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.
Public/Granted literature
- US12002913B2 Display backplane and fabrication method thereof, display panel and fabrication method thereof Public/Granted day:2024-06-04
Information query
IPC分类: