- 专利标题: Semiconductor Device and Method
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申请号: US17838649申请日: 2022-06-13
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公开(公告)号: US20220328661A1公开(公告)日: 2022-10-13
- 发明人: I-Hsieh Wong , Yen-Ting Chen , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/08 ; H01L29/78
摘要:
In an embodiment, a method includes: forming a fin extending from a substrate, the fin having a first width and a first height after the forming; forming a dummy gate stack over a channel region of the fin; growing an epitaxial source/drain in the fin adjacent the channel region; and after growing the epitaxial source/drain, replacing the dummy gate stack with a metal gate stack, the channel region of the fin having the first width and the first height before the replacing, the channel region of the fin having a second width and a second height after the replacing, the second width being less than the first width, the second height being less than the first height.
公开/授权文献
- US11949002B2 Semiconductor device and method 公开/授权日:2024-04-02
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