- 专利标题: ON-DIE THERMAL SENSING NETWORK FOR INTEGRATED CIRCUITS
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申请号: US17630995申请日: 2020-07-29
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公开(公告)号: US20220268644A1公开(公告)日: 2022-08-25
- 发明人: Eyal FAYNEH , Guy REDLER , Evelyn LANDMAN , Inbar WEINTROB , Yahel DAVID , Faten TANASRA
- 申请人: PROTEANTECS LTD.
- 申请人地址: IL Haifa
- 专利权人: PROTEANTECS LTD.
- 当前专利权人: PROTEANTECS LTD.
- 当前专利权人地址: IL Haifa
- 国际申请: PCT/IL2020/050840 WO 20200729
- 主分类号: G01K15/00
- IPC分类号: G01K15/00 ; G01K7/32
摘要:
A semiconductor integrated circuit (IC) comprising: a first ring oscillator (ROSC) circuit and a second ROSC circuit at spaced apart locations in the IC, each ROSC circuit having a respective oscillation frequency in operation that varies with temperature; a semiconductor temperature sensor, located in the IC proximate to the first ROSC circuit and providing a sensor output signal indicative of temperature; and at least one processor, configured to indicate a temperature at the second ROSC circuit based at least on: the sensor output signal, the oscillation frequency of the second ROSC circuit, and the oscillation frequency of the first ROSC circuit.
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