发明申请
- 专利标题: Backboard Support Structure, Preparation Method Therefor, and the Display Device
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申请号: US16955442申请日: 2019-07-30
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公开(公告)号: US20220141967A1公开(公告)日: 2022-05-05
- 发明人: Penghao Gu , Chunyan Xie , Shiming Shi
- 申请人: BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing
- 国际申请: PCT/CN2019/098421 WO 20190730
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; B32B7/022 ; B32B7/12 ; B32B27/08 ; B32B17/10 ; B32B27/28 ; B32B27/36 ; B32B3/30
摘要:
Provided are a backboard support structure, a preparation method therefor, and a display device. The display device includes a display substrate and a backboard support structure; the backboard support structure includes a substrate support film and an adhesive layer arranged in a laminated manner. The backboard support structure is bonded to the non-display side of the display substrate via the adhesive layer, and includes a first bendable region and a first non-bent region. The adhesive layer includes a first portion located in the first bendable region and a second portion located in the first non-bent region; the first portion has a modulus of elasticity of about 1 Kpa-150 Kpa, the second portion has a modulus of elasticity of about 150 Kpa-250 Kpa, and the substrate support film has a modulus of elasticity of about 1 Gpa-10 Gpa.
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