Invention Application
- Patent Title: INTEGRATED CIRCUIT DEVICE
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Application No.: US17563416Application Date: 2021-12-28
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Publication No.: US20220123103A1Publication Date: 2022-04-21
- Inventor: Kyooho JUNG , Jeonggyu SONG , Younsoo KIM , Jooho LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0068801 20190611
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/285 ; H01L27/108

Abstract:
An integrated circuit device includes a lower electrode including a niobium (Nb)-containing layer doped with titanium (Ti), a dielectric layer on the lower electrode, and an upper electrode that covers the dielectric layer.
Information query
IPC分类: