- 专利标题: MULTI- WALL THICKNESS, THIN-WALLED HONEYCOMB BODIES, AND EXTRUSION DIES AND METHODS THEREFOR
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申请号: US16954250申请日: 2018-12-16
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公开(公告)号: US20210362370A1公开(公告)日: 2021-11-25
- 发明人: Ravindra Kumar Akarapu , Amit Halder , Priyank Paras Jain , Weidong Li
- 申请人: CORNING INCORPORATED
- 申请人地址: US NY Corning
- 专利权人: CORNING INCORPORATED
- 当前专利权人: CORNING INCORPORATED
- 当前专利权人地址: US NY Corning
- 国际申请: PCT/US2018/065893 WO 20181216
- 主分类号: B28B3/26
- IPC分类号: B28B3/26 ; B29C48/00 ; B29C48/11 ; B29C48/345 ; F01N3/28
摘要:
A thin-walled honeycomb body (100) having a plurality of repeating cell structures (110) formed of intersecting porous thick walls (112V, 112H) and thin walls (114V, 114H). Each repeating cell structure (110) is bounded on its periphery by the thick walls (112V, 122H) of a first transverse thickness (Tk) and the thin walls (114V, 114H) have a second transverse thickness (Tt) that subdivides each repeating cell structure (110) into between 7 and 36 individual cells (108). In the thin-walled honeycomb body (100), the first transverse thickness (Tk) of the thick walls (112V, 112H) is less than or equal to 0.127 mm (0.005 inch) and the second transverse thickness (Tt) of the thin walls (114V, 114H) is less than or equal to 0.0635 mm (0.0025 inch), and Tk>Tt. Honeycomb extrusion dies and methods of manufacturing the thin-walled honeycomb body (100) having thick walls (112V, 112H) and thin walls (114V, 114H) are provided.
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