Invention Application
- Patent Title: ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY YIELD
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Application No.: US16845404Application Date: 2020-04-10
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Publication No.: US20210320056A1Publication Date: 2021-10-14
- Inventor: Krishna R. Tunga , Thomas Weiss , Charles Leon Arvin , Bhupender Singh , Brian W. Quinlan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/538 ; H01L21/50

Abstract:
An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.
Public/Granted literature
- US11282773B2 Enlarged conductive pad structures for enhanced chip bond assembly yield Public/Granted day:2022-03-22
Information query
IPC分类: