- 专利标题： METHOD FOR FORMING SEMICONDUCTOR PACKAGE
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申请号： US17320981申请日： 2021-05-14
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公开(公告)号： US20210272869A1公开(公告)日： 2021-09-02
- 发明人: Chin-Hua WANG , Po-Yao LIN , Feng-Cheng HSU , Shin-Puu JENG , Wen-Yi LIN , Shu-Shen YEH
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L25/065 ; H01L23/373 ; H01L23/31 ; H01L25/10 ; H01L21/48 ; H01L21/56 ; H01L23/433
摘要：
A method of forming a semiconductor package is provided. The method includes mounting a chip on a package substrate. The method further includes placing a heat spreader over the chip and applying a thermal interface material to a first surface of the heat spreader facing the chip. The heat spreader is flexible. In addition, the method includes attaching the heat spreader to the chip through the thermal interface material by rolling a rod over a second surface of the heat spreader, and the second surface is opposite to the first surface.
公开/授权文献
- US11862528B2 Method for forming semiconductor package 公开/授权日：2024-01-02
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