Invention Application
- Patent Title: DIODES FOR PACKAGE SUBSTRATE ELECTROSTATIC DISCHARGE (ESD) PROTECTION
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Application No.: US16724257Application Date: 2019-12-21
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Publication No.: US20210193644A1Publication Date: 2021-06-24
- Inventor: Aleksandar Aleksov , Adel A. Elsherbini , Feras Eid , Veronica Aleman Strong , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/872
Abstract:
Embodiments may relate to a package substrate that is to couple with the die. The package substrate may include a signal line that is communicatively coupled with the die. The package substrate may further include a conductive line. The package substrate may further include a diode communicatively coupled with the signal line and the conductive line. Other embodiments may be described or claimed.
Public/Granted literature
- US11424239B2 Diodes for package substrate electrostatic discharge (ESD) protection Public/Granted day:2022-08-23
Information query
IPC分类:
