- 专利标题： PACKAGING OF A SEMICONDUCTOR DEVICE WITH DUAL SEALING MATERIALS
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申请号： US17196317申请日： 2021-03-09
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公开(公告)号： US20210193546A1公开(公告)日： 2021-06-24
- 发明人: Soichi SAKAMOTO , Junji FUJINO , Hiroshi KAWASHIMA , Taketoshi MAEDA
- 申请人： Mitsubishi Electric Corporation
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2017-036976 20170228
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/08 ; H01L23/29 ; H01L23/433 ; H01L23/00
摘要：
The present invention provides a semiconductor device including an insulating layer, a conductive layer bonded to one main surface of the insulating layer, a semiconductor element arranged such that the upper surface of the semiconductor element faces a direction same as the one main surface of the insulating layer, an upper electrode provided on the upper surface of the semiconductor element, a wiring member that has one end electrically bonded to the upper electrode of the semiconductor element and has another end electrically bonded to the conductive layer, and has a hollow portion, a first sealing material, and a second sealing material, in which the first sealing material seals at least part of the semiconductor element so as to be in contact with the semiconductor element, and the second sealing material seals the wiring member so as to be in contact with the wiring member.
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