Invention Application
- Patent Title: MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
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Application No.: US16656304Application Date: 2019-10-17
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Publication No.: US20210119110A1Publication Date: 2021-04-22
- Inventor: Da-Jun Lin , Bin-Siang Tsai , Ting-An Chien
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/10 ; H01L43/12

Abstract:
A cell structure of magnetoresistive RAM includes a synthetic anti-ferromagnetic (SAF) layer to serve as a pinned layer; a barrier layer, disposed on the SAF layer; and a magnetic free layer, disposed on the barrier layer. The SAF layer includes: a first magnetic layer; a second magnetic layer; and a spacer layer of a first metal element sandwiched between the first magnetic layer and the second magnetic layer. The first metal element is phase separated from a second metal element of the first magnetic layer and the second magnetic layer interfacing with the spacer layer.
Public/Granted literature
- US11258005B2 Magnetoresistive random access memory device and method for fabricating the same Public/Granted day:2022-02-22
Information query
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