Invention Application
- Patent Title: HIGH-BAND ENCODING METHOD AND DEVICE, AND HIGH-BAND DECODING METHOD AND DEVICE
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Application No.: US17138106Application Date: 2020-12-30
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Publication No.: US20210118451A1Publication Date: 2021-04-22
- Inventor: Ki-hyun CHOO , Eun-mi OH
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Main IPC: G10L19/002
- IPC: G10L19/002 ; G10L19/02 ; G10L21/038

Abstract:
A high-band encoding/decoding method and device for bandwidth extension are provided. A high-band encoding method comprising the steps of: generating sub band-specific bit allocation information on the basis of a low-band envelope; determining, on the basis of the sub band-specific bit allocation information, the sub band requiring an envelope update in a high band; and generating, for the determined sub band, refinement data relating to the envelope update. A high-band decoding method comprising the steps of: generating sub band-specific bit allocation information on the basis of a low-band envelope; determining, on the basis of the sub band-specific bit allocation information, the sub band requiring an envelope update in a high band; and decoding, for the determined sub band, refinement data relating to the envelope update, thereby updating the envelope.
Public/Granted literature
- US11688406B2 High-band encoding method and device, and high-band decoding method and device Public/Granted day:2023-06-27
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