Invention Application
- Patent Title: ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS
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Application No.: US16890346Application Date: 2020-06-02
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Publication No.: US20210100087A1Publication Date: 2021-04-01
- Inventor: Gayatri Natu , Geetika Bajaj , Prerna Goradia , Darshan Thakare , David Fenwick , XiaoMing He , Sanni Seppaelae , Jennifer Sun , Rajkumar Thanu , Jeff Hudgens , Karuppasamy Muthukamatchy , Arun Dhayalan
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Priority: IN201941038863 20190926
- Main IPC: H05F1/02
- IPC: H05F1/02 ; H01L21/687 ; H01J37/32 ; B25J18/00

Abstract:
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
Public/Granted literature
- US11547030B2 Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools Public/Granted day:2023-01-03
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