- 专利标题： SEMICONDUCTOR MODULE
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申请号： US16844199申请日： 2020-04-09
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公开(公告)号： US20210066175A1公开(公告)日： 2021-03-04
- 发明人: Satoshi KONDO , Hidetoshi ISHIBASHI , Hiroshi YOSHIDA , Nobuhiro ASAJI , Junji FUJINO , Yusuke ISHIYAMA , Hodaka ROKUBUICHI
- 申请人： Mitsubishi Electric Corporation
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2019-160675 20190903
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/28 ; H01L23/18 ; H05K3/10 ; H05K3/34 ; H05K3/30 ; H01L23/00
摘要：
A semiconductor module includes: an insulated circuit board; a semiconductor device mounted on the insulated circuit board; a printed wiring board arranged above the insulated circuit board and the semiconductor device and having a through-hole; a metal pile having a lower end bonded to an upper surface of the semiconductor device and a cylindrical portion penetrating through the through-hole and bonded to the printed wiring board; a case surrounding the insulated circuit board, the semiconductor device, the printed wiring board and the metal pile; and a sealing material sealing an inside of the case.
公开/授权文献
- US11424178B2 Semiconductor module 公开/授权日：2022-08-23
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