Invention Application
- Patent Title: ReRAM STRUCTURE AND METHOD OF FABRICATING THE SAME
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Application No.: US16576784Application Date: 2019-09-20
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Publication No.: US20210057643A1Publication Date: 2021-02-25
- Inventor: Shih-Min Chou , Kuo-Chih Lai , Wei-Ming Hsiao , Hui-Ting Lin , Szu-Yao Yu , Nien-Ting Ho , Hsin-Fu Huang , Chin-Fu Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN201910784725.7 20190823
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
An ReRAM structure includes a dielectric layer. A first ReRAM and a second ReRAM are disposed on the dielectric layer. The second ReRAM is at one side of the first ReRAM. A trench is disposed in the dielectric layer between the first ReRAM and the second ReRAM. The first ReRAM includes a bottom electrode, a variable resistive layer and a top electrode. The variable resistive layer is between the bottom electrode and the top electrode. A width of the bottom electrode is smaller than a width of the top electrode. The width of the bottom electrode is smaller than a width of the variable resistive layer.
Public/Granted literature
- US11165019B2 ReRAM structure and method of fabricating the same Public/Granted day:2021-11-02
Information query
IPC分类: