- 专利标题： CHIP PACKAGE WITH LID
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申请号： US17034891申请日： 2020-09-28
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公开(公告)号： US20210013160A1公开(公告)日： 2021-01-14
- 发明人: Shu-Shen YEH , Chin-Hua WANG , Kuang-Chun LEE , Po-Yao LIN , Shyue-Ter LEU , Shin-Puu JENG
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/04 ; H01L23/367 ; H01L23/10
摘要：
Structures and formation methods of a chip package are provided. The chip package includes a substrate and a semiconductor die over the substrate. The chip package also includes a lid covering a top surface of the semiconductor die. The lid has a first support structure and a second support structure, and the first support structure and the second support structure are positioned at respective corner portions of the substrate. An opening penetrates through the lid to expose a space containing the semiconductor die, and the lid has a side edge extending from an edge of the first support structure to an edge of the second support structure.
公开/授权文献
- US11410939B2 Chip package with lid 公开/授权日：2022-08-09
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