Invention Application
- Patent Title: LEAD-FREE COLUMN INTERCONNECT
-
Application No.: US16358658Application Date: 2019-03-19
-
Publication No.: US20200303339A1Publication Date: 2020-09-24
- Inventor: CHARLES L. ARVIN , Clement J. Fortin , Christopher D. Muzzy , Krishna R. Tunga , Thomas Weiss
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/532
Abstract:
Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.
Public/Granted literature
- US10950573B2 Lead-free column interconnect Public/Granted day:2021-03-16
Information query
IPC分类:
