发明申请
- 专利标题: FINGERPRINT SENSING MODULE
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申请号: US16526418申请日: 2019-07-30
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公开(公告)号: US20200134277A1公开(公告)日: 2020-04-30
- 发明人: Yu-Hsuan Lin , Tang-Hung Po , Hsien-Hsiang Chiu , Chung-Yi Wang
- 申请人: Egis Technology Inc. , Igistec Co., Ltd.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6603ca08
- 主分类号: G06K9/00
- IPC分类号: G06K9/00 ; G06F3/041
摘要:
A fingerprint sensing module includes a fingerprint sensing pixel array, a plurality of column circuitries and a constant current circuit. The fingerprint sensing pixel array includes a plurality of sensing pixels in an array arrangement. Each column circuitry is electrically coupled to a row of the sensing pixels via a corresponding row signal line. The constant current circuit generates a bias voltage to the column circuitries according to a reference current. In response to the bias voltage level, a row output current provided by each column circuitry and flowing through each row of the sensing pixels is equal to or close to the reference current. Since the row output current coincides with the reference current, the row output current is not adversely affected by the external factors.
公开/授权文献
- US10824836B2 Fingerprint sensing module 公开/授权日:2020-11-03
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