Invention Application
- Patent Title: ELECTRONIC DEVICE
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Application No.: US16566502Application Date: 2019-09-10
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Publication No.: US20200083143A1Publication Date: 2020-03-12
- Inventor: Jung-Che TSAI , Ian HU , Chih-Pin HUNG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/36 ; H01L23/00
Abstract:
An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.
Public/Granted literature
- US11139222B2 Electronic device comprising heat pipe contacting a cover structure for heat dissipation Public/Granted day:2021-10-05
Information query
IPC分类:
