Invention Application
- Patent Title: RF SENSING APPARATUS OF PLASMA PROCESSING CHAMBER AND PLASMA PROCESSING CHAMBER INCLUDING SAME
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Application No.: US16261175Application Date: 2019-01-29
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Publication No.: US20200072874A1Publication Date: 2020-03-05
- Inventor: YOUNG DO KIM , SUNG YONG LIM , CHAN SOO KANG , DO HOON KWON , MIN JU KIM , SANG KI NAM , JUNG MO YANG , JONG HUN PI , KYU HEE HAN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2018-0101556 20180828
- Main IPC: G01R15/18
- IPC: G01R15/18 ; G01R15/16 ; H01F27/28 ; H05H1/46

Abstract:
An RF sensing apparatus configured for use with a plasma processing chamber includes a penetration unit opened in an up/down direction, a main return path unit surrounding all or a portion of the penetration unit, and a secondary return path unit located between the penetration unit and the main return path unit, spaced apart from the main return path unit, and surrounding all or a portion of the penetration unit. The main return path unit and the secondary return path unit include a path through which a current flows in one of the up/down directions.
Public/Granted literature
- US10901007B2 RF sensing apparatus of plasma processing chamber and plasma processing chamber including same Public/Granted day:2021-01-26
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