Invention Application
- Patent Title: QUANTUM DOT LIGHT-EMITTING DIODE SUBSTRATE HAVING A BONDING LAYER, AND METHOD OF PREPARING THE SAME
-
Application No.: US16585599Application Date: 2019-09-27
-
Publication No.: US20200028106A1Publication Date: 2020-01-23
- Inventor: Yanzhao LI , Chungchun LEE , Zhuo CHEN , Yuanming ZHANG
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Priority: CN201610012450.1 20160108
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L51/56 ; B05D1/00 ; H01L21/82

Abstract:
A quantum dot light-emitting diode substrate having a bonding layer and a method of preparing the same are provided. The quantum dot light-emitting diode substrate including a plurality of sub-pixel light-emitting regions, wherein each of the sub-pixel light-emitting regions includes a light-emitting layer including a bonding layer and a quantum dot bonded to the bonding layer. The quantum dot light-emitting diode substrate can be prepared with high resolution by a convenient process, and is suitable for mass production.
Information query
IPC分类: