A semiconductor structure includes a first die, a molding at least partially surrounding the first die, a via extended through the molding, a second die disposed over the molding, a connector dispose between the second die and the via, and an underfill at least partially surrounding the connector. The first die includes a first surface and a second surface opposite to the first surface. The second die includes a third surface facing the first die, a fourth surface opposite to the third surface, and a sidewall between the third surface and the fourth surface. The connector is in contact with the third surface of the second die and the via. The second die is electrically connected to the via. The underfill covers a portion of the sidewall of the second die and a portion of the second surface of the first die.